The MSI LB1000 Laser Bonding Equipment provides superior process control and feedback through the use of a closed-loop control system featuring integrated infrared temperature and laser power sensors.
The ability to control CO2 laser wattage or bond site temperature creates an accurate and repeatable process cycle to cycle and machine to machine. The LB1000 also features a user defined beam width configured in a column shape rather than a single spot. This allows the beam to consistently contact the product even with bent mandrels.
The LB1000 includes a PLC control system with user friendly PC touch screen interface for easy process development and product changeover. The process sequence builder is extremely flexible allowing the user to tailor the process to match specific bonding needs. Additional user friendly features include drop-in product handling, bar code scanning, integrated vision assist and jog controls for easy bond site alignment to the laser column. Applications include proximal/distal balloon bonds, soft tip attachment and other catheter/tube bonding processes.
